What are the considerations in power module packaging design?

Power module packaging affects electrical and thermal performance: die attach (solder vs sintering for high-temperature operation), wire bonding vs copper clips (inductance and current capacity), substrate material (Al2O3, AlN, Si3N4 for thermal conductivity and CTE matching), baseplate (copper or AlSiC), thermal interface, and encapsulation. Electrical considerations: minimize loop inductance (<10nH for fast switching), balanced gate paths, integration of gate driver, and thermal sensors. Reliability requires managing thermal cycling stress (CTE mismatches) and power cycling capability. Advanced packaging includes double-sided cooling and 3D integration.